LGA 3647


LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200, Xeon Phi 72x5, Skylake-SP, Cascade Lake-SP/AP, Skylake-SP and Cascade Lake-W microprocessors.
The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect, as a replacement for QPI, and 100G Omni-Path interconnect.

Variants

There are two sub-versions of this socket with differences in the ILM, and the processor package carrier frame preventing mounting the other version's heatsink. Noctua heatsinks designed for this socket come with both square and narrow carrier frames.