List of Intel manufacturing sites
The following is a list of Intel's manufacturing and assembly/test sites. Processors are manufactured in semiconductor fabrication plants which are then sent to assembly and testing sites before delivery to customers. Approximately 75% of Intel's semiconductor fabrication is performed in the USA.
Current Fab Sites
Fab | Location | Square Feet | Use |
D1C | Oregon | 135,000 | 14/10nm |
RP1 | Oregon | 56,000 | Research |
D1D | Oregon | 176,000 | 14/10nm |
- Total Current Fab Space - 955,000 square feet clean room space.
- * New production - D1X Oregon $5B expansion,Fab 42 Arizona $7B, Fab 24 Ireland $8B expansion, Israel, $10.9B
- ** Estimated Year to Enter Operations
- *** Oregon 2020-2021
- *** Arizona 2020
- *** Ireland 2023
- *** Israel 2023+
Fab name | Location | Opened | Closed | Notes |
Fab 1 | Mountain View, California, USA | 1968 | ||
Fab 2 | Santa Clara, California, USA | 1968 | ||
Fab 3 | North Mines Road, Livermore, California, USA | 1972 | 1991 | Plant began making wafers in April 1973. First plant outside of the Santa Clara area, and is where the famous Bunny Suits were first introduced. |
Fab 4 | Aloha, Oregon, USA | 1976 | 1996 2016 | First wafer manufacturing plant outside of Silicon Valley and first facility in what is now known as Oregon's Silicon Forest. Production began for 3-inch wafers. |
Fab 5 / D1 | Aloha, Oregon, USA | Previously a development facility, then production facility. Currently inactive. | ||
Fab 6 | Chandler, Arizona, USA | 1980 | 2000 | First silicon wafer manufacturing facility in Arizona. Key architecture was the 286 microprocessor. |
Fab 7 | Rio Rancho, New Mexico, USA | 1980 | 2002 2005 | Production focused on flash memory chips. By the time production stopped, plant was producing 0.35 micron-6 inch wafers. In 2005, $105 million was invested to temporarily turn Fab 7 into a testing facility. |
Fab 8 | Jerusalem, Israel | 1985 | 2008 2009 | First Fab outside of the United States. Ended production with, what was at the time, the last 6-inch wafer fab. Building was converted into die prep facility to support nearby Fab 28. |
Fab 9 | Rio Rancho, New Mexico, USA | 1987 | Facility eventually expanded to merge with Fab 11 in 1999. | |
D2 | Santa Clara, California, USA | 1989 | 2009 | After being decommissioned, was converted into a data center. |
Fab 10 / IFO | Leixlip, Ireland | |||
Fab 11 | Rio Rancho, New Mexico, USA | |||
Fab 14 | Leixlip, Ireland | |||
Fab 15 / D1A | Aloha, Oregon, USA | 2003 | Previously a development Fab named D1A before construction began on D1B in 1994. | |
Fab 16 | Ft. Worth, Texas, USA | 2003 | Planned to open in Ft. Worth, Texas in 1999, but was eventually cancelled in 2003. | |
Fab 17 | Hudson, Massachusetts, USA | 1998 | 2014 | Facility used older technology and closed because site was not large enough to accommodate a leading-edge fab. Made specialty products on the trailing edge of chip technology, and was last to make chips on 200-millimeter silicon wafers. |
Fab 20 / D1B | Hillsboro, Oregon, USA | |||
Fab 23 | Colorado Springs, Colorado, USA | 2000 | 2007 | Site originally purchased from Rockwell, but due to lack of demand and for financial reasons, Intel put it up for sale in 2007. It eventually sold in 2011 to the El Paso County government, who repurposed the offices. |
Assembly/test sites
- AFO, Aloha, Oregon, United States
- Chandler, Arizona, United States
- CD1, Chengdu, Sichuan, China
- CD6, Chengdu, Sichuan, China
- KMO, Kulim, Malaysia
- KM5, Kulim, Malaysia
- PG8, Penang, Malaysia
- VNAT, Ho Chi Minh City, Vietnam
- Jerusalem, Israel
- CRAT, Heredia, Belén, Costa Rica
- Makati, Philippines - MN1-MN5 also known as A2/T11
- Cavite, Philippines - CV1-CV4
- Shanghai, China