The role of the substrate in power electronics is to provide the interconnections to form an electric circuit, and to cool the components. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation. They also must operate over a wide temperature range.
Direct bonded copper substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile with a sheet of copper bonded to one or both sides by a high-temperature oxidation process. The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it. Ceramic material used in DBC include:
Aluminium nitride, which is more expensive, but has far better thermal performance.
Beryllium oxide, which has good thermal performance, but is often avoided because of its toxicity when the powder is ingested or inhaled.
One of the main advantages of the DBC substrates is their low coefficient of thermal expansion, which is close to that of silicon. This ensures good thermal cycling performances. The DBC substrates also have excellent electrical insulation and good heat spreading characteristics. A related technique uses a seed layer, photoimaging, and then additional copper plating to allow for fine lines and through-vias to connect front and back sides. This can be combined with polymer-based circuits to create high density substrates that eliminate the need for direct connection of power devices to heat sinks.
Active metal brazed substrate
Another technology to attach thick metal layers to ceramic plates is the AMB technology. With this process a metal foil is soldered to the ceramic using als solder paste and high temperature. The process itself requires vacuum. Therefore, though AMB is electrically very similar to DBC, it is only suited for small production lots.
Insulated metal substrate
Insulated metal substrate consists of a metal baseplate covered by a thin layer of dielectric and a layer of copper. The FR-4-based dielectric is usually thin because it has poor thermal conductivity compared to the ceramics used in DBC substrates. Due to its structure, the IMS is a single-sided substrate, i.e. it can only accommodate components on the copper side. In most applications, the baseplate is attached to a heatsink to provide cooling, usually using thermal grease and screws. Some IMS substrates are available with a copper baseplate for better thermal performances. Compared to a classical printed circuit board, the IMS provides a better heat dissipation. It is one of the simplest way to provide efficient cooling to surface mount components.
Other substrates
When the power devices are attached to a proper heatsink, there is no need for a thermally efficient substrate. Classical printed circuit board material can be used. This is also true for low-power applications, as the PCB can be thermally enhanced by using thermal vias or wide tracks to improve convection. An advantage of this method is that multilayer PCB allows design of complex circuits, whereas DBC and IMS are mostly single-sided technologies.
Flexible substrates can be used for low-power applications. As they are built using Kapton as a dielectric, they can withstand high temperatures and high voltages. Their intrinsic flexibility makes them resistant to thermal cycling damage.
Ceramic substrates can also be used in some applications where reliability is of highest importance. Compared to DCBs, thick film technology offers a higher degree of design freedom but may be less cost-efficient.
The thermal performances of IMS, DBC and thick film substrate are evaluated in Thermal analysis of high-power modules Van Godbold, C., Sankaran, V.A. and Hudgins, J.L., IEEE Transactions on Power Electronics, Vol. 12, N° 1, Jan 1997, pages 3–11, ISSN 0885-8993
