Soviet integrated circuit designation
This article describes the nomenclature for integrated circuits manufactured in the Soviet Union. 25 years after the dissolution of the Soviet Union this designation is still used by a number of [|manufacturers] in Russia, Belarus, Ukraine, Latvia, and Uzbekistan. The designation uses the Cyrillic alphabet which sometimes leads to confusion where a Cyrillic letter has the same appearance as a Latin letter but is romanized as a different letter. Furthermore, for some Cyrillic letters the [|Romanization] is ambiguous.
History
The nomenclature for integrated circuits has changed somewhat over the years as new standards were published:- 1968 – NP0.034.000
- 1973 – GOST 18682—73
- 1980 – OST 11.073.915—80
- 2000 – OST 11.073.915—2000
- 2010 – GOST RV 5901-005—2010
Also as a consequence of dissolution of the Soviet Union, COCOM restrictions were lifted and Russian integrated circuit design firms gained access to foundries abroad. In that sense it could be argued that the importance of the Soviet designation has spread across the globe. When foundries are not able to label the circuit in the Cyrillic alphabet then the Latin alphabet is used.
In general, devices already in production when a new standard came out kept their old designation. However, in some case devices were renamed:
- When the 1980 standard was published, devices named after the 1968 standard and still in production were renamed, e.g. К1ЛБ553 to К155ЛА3. As in this example, the renaming was often fairly straightforward: The two parts of the serial number were combined, the functional group remained unchanged or was converted as in the table below, and the variant number remained unchanged. In some series the renaming was more complicated. This change affected many series.
- Before the introduction of a package designation in 1980 the suffix П was used in some series to indicate a plastic package. In 1983 the package designation was changed for the 531 series. Other series were similarly renamed at some point.
- Before the definition of group В in 1980 computing devices were all assigned subgroup ИК, e.g. microprocessors, peripheral devices. With the introduction of group В the devices in the 580 series were renamed in 1986.
- Starting in 2016, certain newer devices were renamed according to the 2010 standard, e.g. 1967ВЦ2Ф to 1967ВН028 and 1586ПВ1АУ to 1583НВ025.
Structure of the designation
Structure (1968)
Structure (1973 / 1980)
Structure (2000)
Structure (2010)
Elements:- ' – Prefix
- * ' – Export designation: The letter Э here indicates an integrated circuit intended for export with a pin spacing of 2.54mm or 1.27mm. If this element is empty then the device has the Soviet spacing of 2.5mm or 1.25mm between pins.
- * ' – Application area: The letter К here indicates an integrated circuit for commercial and consumer applications. If this element is empty then the device is intended for harsher environments which is also referred to as military acceptance.
- * ' – Package designation
- ' – Series
- * ' – Manufacturing technology :
- ** Monolithic integrated circuits: 1, 5, or 6
- ** Monolithic integrated circuits – [|bare chip] without package: 7
- ** Hybrid integrated circuits: 2, 4, or 8
- ** Other integrated circuits : 3
- ** Multi-chip modules: 9
- * ' – For four-digit series the second digit of the number of the series has significance as well:
- ** Series for household electronics: 0
- ** Series of analogue devices: 1
- ** Series of operational amplifiers: 4
- ** Series of digital devices: 5
- ** Series of memory devices: 6
- ** Series of microprocessor families: 8
- * ' – Number of the series : The numbers of the series are assigned sequentially and have no further meaning. Devices in a series have some characteristic in common although it varies from one series to another which characteristic that is.
- * ' – Number of the series : The 2000 / 2010 standards do not assign a special meaning to the second digit of a 4-digit series.
- ' – [|Functional Group]
- * ' – Group
- * ' – Subgroup within the group: All groups have the subgroup П for "others", that is for devices that fall into the group but not into any of the other defined subgroups.
- * ' – Functional Group : The functional groups for the 2010 standard are in a separate table since the change from 2000 to 2010 is far more drastic than any of the previous changes.
- ' – Variant within the functional subgroup : Usually the variant numbers are assigned sequentially for devices within the subgroup. In some series the variant number matches the last two or three digits of the designation of its Western counterpart.
- * ' – For the 2010 standard, the variant is always 2 digits in length, with a leading zero if necessary. When there is no version letter then the variant appears to be 3 digits in length but the third digit is actually the package designation.
- ' – Suffix
- * ' – Version : This optional element indicates versions of an integrated circuit with different electrical or thermal characteristics. It can also indicate an improved version of a device. Before 1980 the suffix П was sometimes used to indicate a version in a plastic package instead of a ceramic package or a round metal can.
- * ' – Version : This element is omitted if there is only one version of a device.
- * ' – Package designation : If this element is empty then the package is simply not specified in the designation, i.e. it could be any of the packages. Note that the letter ranges for version and package designation do not overlap.
- * ' – [|Manufacturer designation]
- * ' – Package designation
- * ' - Package variant : If variants of an integrated circuit have the same parameters and package designation but differ in pinout or number of pins, then this package variant letter is added.
- * – Version : This element is omitted if there is only one version of a device. Note that for the 2010 standard a different package is indicated by element 5f instead. Some vendors still assign version letters outside the allowed range.
Functional Groups
Functional Groups (2010)
Packages
Package designation (1973)
The package of an integrated circuit was generally not indicated in the 1973 designation, except:- [|Bare chips] without a package received a series number in the 7xx range, e.g. K712RV2-1.
- The suffix П was sometimes used to indicate a version in a plastic package instead of a ceramic package or a round metal can.
- Less common than П, the suffix М was sometimes used to indicate a ceramic package and Т for a metal-ceramic package.
Package designation (1980)
Package designation (2000)
Package designation (2010)
Bare chips
For bare chips without a package an additional digit indicates the constructive variant. For the 1973 and 1980 standards the variant digit is appended with a dash after the designation. For the 2000 and 2010 standards the variant digit follows immediately after the package designation N.| Constructive variant | Description |
| 1 | with flexible wires |
| 2 | on polyamide carrier tape |
| 3 | with rigid wires |
| 4 | on a wafer |
| 5 | on a wafer, cut without loss of orientation |
| 6 | with bonding pads without wires |
Manufacturer designation
A manufacturer designation was introduced only with the 2000 standard. The table below is incomplete, many manufacturers still do not use their assigned designation. Manufacturer logosare more common.
Other manufacturers which as of 2016 used a version of the Soviet integrated circuit designation include NTC Module, MCST, ELVEES Multicore, Fizika, Optron, Sapfir, NPK TTs, and Progress, all of them in Moscow, as well as PKK Milandr, Soyuz, and NIITAP in Zelenograd, NIIET Voronezh, SKTB ES Voronezh, Proton and Proton-Impuls Oryol, Vostok Novosibirsk, NZPP-KBR Nalchik, Planeta Novgorod, Iskra Ulyanovsk, NIIEMP Penza, Almaz Kotovsk, Eltom Tomilino, Krip Tekhno Alexandrov, DELS Minsk, Kvazar Kiev, Kristall Kiev, Elektronni Komponenti Ivano-Frankivsk, Dnepr Kherson, and Foton Tashkent.
Other Markings
Although not strictly part of the designation, a number of markings are often found on integrated circuit packages:Military acceptance here means that the integrated circuit can be used in applications where its failure would be catastrophic and where repair or exchange is difficult or impossible.
For mask-programmed devices a three or four digit mask number follows the type designation.
For bare chips a one digit [|constructive variant identifier] follows the type designation.
A date code is usually printed on the package. In the early 1970s the date code consisted of a Roman numeral for the month and a two-digit year. Later the month was given as one or two digits. In the late 1980s most plants switched to a 4-digit code with a 2-digit year followed by a 2-digit month or a 2-digit week. Overall, the date code format was not strictly enforced. Several series of integrated circuits bore an IEC 60062 letter and digit code.
Romanization
The Romanization of Russian is standardized, only there are at least 11 standards to choose from. Fortunately, the Soviet integrated circuit designation uses a subset of the Cyrillic alphabet where rather few letters are ambiguous:- Ж: Ž, Zh
- Х: X, H, Ch, Kh
- Ц: C, Cz, Ts, Tc
- Ч: Č, Ch
Е and Э are both romanized as E.
The :fr:Transcription du russe en français|French romanization of Russian and the :de:Kyrillisches Alphabet#Russisch|German romanization of Russian differ in some letters from the one used in English. For instance, the Russian КР580ВМ80A becomes KR580VM80A in English and French but KR580WM80A in German literature.